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電子產(chǎn)業(yè)一站式服務(wù)平臺(tái)
制造商：ADI/AD
優(yōu)勢(shì)和特點(diǎn)
Wide IF Bandwidth: DC - 17 GHz
Input IP3: +21 dBm
High LO/RF Isolation: 35 dB
Passive Double Balanced Topology
Leadless RoHS Compliant SMT Package, 25 mm2
產(chǎn)品詳情
The HMC560A is a 24 - 40 GHz passive, double-balancedMMIC mixer in a SMT leadless chip carrierpackage. The mixer is fabricated in a GaAs MESFETprocess, and can be used as a downconverter orupconverter. The wide operating bandwidth allows thisdevice to be used across multiple radio bands with acommon platform. Excellent isolations are provided byon-chip baluns. The HMC560A requires no externalcomponents and no DC bias. All data is with the nonhermetic,epoxy sealed LM3 package mounted in a 50Ohm test fixture. Utilizing the HMC560A eliminates theneed for wire bonding, thereby providing a consistentconnection interface for the customer, and allowingthe use of surface mount manufacturing techniques.
Applications
Test Equipment & Sensors
Point-to-Point Radios
Point-to-Multi-Point Radios
Military & Space
HMC560A電路圖
| 型號(hào) | 制造商 | 描述 | 購(gòu)買 |
|---|---|---|---|
| HMC560ALM3TR | - | - | 立即購(gòu)買 |
| HMC560ALM3 | - | - | 立即購(gòu)買 |
簡(jiǎn)介本博文基于世平集團(tuán)的靈動(dòng)微MM32SPIN560C無(wú)刷電機(jī)開發(fā)板在用戶調(diào)試電機(jī)時(shí)，描述在用戶拿到電機(jī)時(shí)從硬件至軟件的調(diào)試過(guò)程。1硬件平臺(tái)靈動(dòng)微MM32SPIN560C無(wú)刷電機(jī)開發(fā)板方案鏈接
簡(jiǎn)介本博文基于世平集團(tuán)的靈動(dòng)微MM32SPIN560C無(wú)刷電機(jī)開發(fā)板在用戶調(diào)試電機(jī)時(shí)，描述在用戶拿到電機(jī)時(shí)從硬件至軟件的調(diào)試過(guò)程。1硬件平臺(tái)靈動(dòng)微MM32SPIN560C無(wú)刷電機(jī)開發(fā)板方案鏈接
簡(jiǎn)介本博文基于世平集團(tuán)的靈動(dòng)微MM32SPIN560C無(wú)刷電機(jī)開發(fā)板在用戶調(diào)試電機(jī)時(shí)，描述在用戶拿到電機(jī)時(shí)從硬件至軟件的調(diào)試過(guò)程。1硬件平臺(tái)靈動(dòng)微MM32SPIN560C無(wú)刷電機(jī)開發(fā)板方案鏈接
簡(jiǎn)介本博文基于世平集團(tuán)的靈動(dòng)微MM32SPIN560C無(wú)刷電機(jī)開發(fā)板在用戶調(diào)試電機(jī)時(shí)，描述在用戶拿到電機(jī)時(shí)從硬件至軟件的調(diào)試過(guò)程。1硬件平臺(tái)靈動(dòng)微MM32SPIN560C無(wú)刷電機(jī)開發(fā)板方案鏈接
簡(jiǎn)介本博文基于世平集團(tuán)的靈動(dòng)微MM32SPIN560C無(wú)刷電機(jī)開發(fā)板在用戶調(diào)試電機(jī)時(shí)，描述在用戶拿到電機(jī)時(shí)從硬件至軟件的調(diào)試過(guò)程。1硬件平臺(tái)靈動(dòng)微MM32SPIN560C無(wú)刷電機(jī)開發(fā)板方案鏈接
簡(jiǎn)介本博文基于世平集團(tuán)的靈動(dòng)微MM32SPIN560C無(wú)刷電機(jī)開發(fā)板在用戶調(diào)試電機(jī)時(shí)，描述在用戶拿到電機(jī)時(shí)從硬件至軟件的調(diào)試過(guò)程。1硬件平臺(tái)靈動(dòng)微MM32SPIN560C無(wú)刷電機(jī)開發(fā)板方案鏈接
簡(jiǎn)介本博文基于世平集團(tuán)的靈動(dòng)微MM32SPIN560C無(wú)刷電機(jī)開發(fā)板在用戶調(diào)試電機(jī)時(shí)，描述在用戶拿到電機(jī)時(shí)從硬件至軟件的調(diào)試過(guò)程。1硬件平臺(tái)靈動(dòng)微MM32SPIN560C無(wú)刷電機(jī)開發(fā)板方案鏈接
簡(jiǎn)介本博文基于世平集團(tuán)的靈動(dòng)微MM32SPIN560C無(wú)刷電機(jī)開發(fā)板在用戶調(diào)試電機(jī)時(shí)，描述在用戶拿到電機(jī)時(shí)從硬件至軟件的調(diào)試過(guò)程。1硬件平臺(tái)靈動(dòng)微MM32SPIN560C無(wú)刷電機(jī)開發(fā)板方案鏈接
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| HMC652LP2E | HMC399 | HMC613 | HMC406 |
| HMC913LC4B | HMC644A | HMC648A | HMC463LH250 |
| HMC639 | HMC832A | HMC557A | HMC865 |
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