The LPS25H is an ultra compact absolute piezoresistive pressure sensor. It includes a monolithic sensing element and an IC interface able to take the information from the sensing element and to provide a digital signal to the external world.

The sensing element consists of a suspended membrane realized inside a single mono-silicon substrate. It is capable to detect pressure and is manufactured using a dedicated process developed by ST.

The membrane is very small compared to the traditionally built silicon micromachined membranes. Membrane breakage is prevented by an intrinsic mechanical stopper.

The IC interface is manufactured using a standard CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the sensing element characteristics.

The LPS25H is available in cavity and fully molded holed LGA package (HLGA). It is guaranteed to operate over a temperature range extending from -30 °C to +105 °C. The package is holed to allow external pressure to reach the sensing element.

lps25h是一種超小型絕對(duì)壓阻式壓力傳感器。它包括一個(gè)單片傳感元件和一個(gè)集成電路接口能夠從傳感元件的信息，并提供一個(gè)數(shù)字信號(hào)到外部世界。

該傳感元件由一個(gè)單一的單體硅襯底上實(shí)現(xiàn)的懸浮膜。它是能夠檢測(cè)到壓力，并使用專(zhuān)用的過(guò)程開(kāi)發(fā)的過(guò)程中開(kāi)發(fā)的。

與傳統(tǒng)的硅微機(jī)械膜相比，該膜是非常小的。防止膜破裂的內(nèi)在機(jī)械塞。

IC接口采用標(biāo)準(zhǔn)的CMOS工藝，允許高層次的集成設(shè)計(jì)專(zhuān)用電路，修整，以更好地匹配傳感元件特性制造。

的lps25h腔完全成型孔LGA封裝是可用的（hlga）。這是保證工作在擴(kuò)展溫度范圍從- 30°C + 105°C.包裝孔允許外部壓力達(dá)到傳感元件。

Key Features

• 260 to 1260 mbar absolute pressure range

• High-resolution mode: 1 Pa RMS

• Low power consumption:

• Low resolution mode: 4 μA

• High resolution mode: 25 μA

• High overpressure capability: 20x full scale

• Embedded temperature compensation

• Embedded 24-bit ADC

• Selectable ODR from 1 Hz to 25 Hz

• SPI and I2C interfaces

• Embedded FIFO

• Supply voltage: 1.7 to 3.6 V

• High shock survivability: 10,000 g

• Small and thin package

• ECOPACK? lead-free compliant

主要特點(diǎn)

260到1260毫巴絕對(duì)壓力范圍

高分辨模式：1帕均方根

低功耗：

低分辨模式：4

高分辨模式：25

高過(guò)壓能力：20X全面

嵌入式溫度補(bǔ)償

嵌入式24位ADC

可選的ODR從1赫茲到25赫茲

我2C接口SPI

嵌入式FIFO

電源電壓：1.7至3.6伏

高沖擊生存能力：10000克

小而薄的包裝

?ECOPACK無(wú)鉛兼容