The LSM6DS3 is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.25 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.

The LSM6DS3 supports main OS requirements, offering real, virtual and batch sensors with 8 kbyte for dynamic data batching.

ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.

The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.

The LSM6DS3 has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±245/±500/±1000/±2000 dps.

High robustness to mechanical shock makes the LSM6DS3 the preferred choice of system designers for the creation and manufacturing of reliable products.

The LSM6DS3 is available in a plastic land grid array (LGA) package.

lsm6ds3包裝具有三維數(shù)字加速度計(jì)和三維數(shù)字陀螺儀在1.25 mA的執(zhí)行系統(tǒng)（高達(dá)1.6 kHz的ODR）在高性能模式，使一直在為消費(fèi)者的最佳運(yùn)動(dòng)體驗(yàn)，低功耗的特點(diǎn)。

lsm6ds3支持主要的操作系統(tǒng)的要求，提供真實(shí)、虛擬和批處理8字節(jié)數(shù)據(jù)動(dòng)態(tài)配料傳感器。

圣家族的MEMS傳感器模塊利用強(qiáng)大的和已經(jīng)用于微機(jī)械加速度計(jì)和陀螺儀的生產(chǎn)制造工藝成熟。

各種傳感元件是利用專門的微加工工藝制造，而IC接口使用CMOS技術(shù)允許一個(gè)專用電路，調(diào)整到更好的匹配傳感元件的特性的設(shè)計(jì)開發(fā)。

lsm6ds3有±2 / 4 / 8 /±±±16 g和125 / 245 /±±±500 / 1000 / 2000±±DPS角速率范圍全面提速范圍。

機(jī)械沖擊的魯棒性高，使lsm6ds3創(chuàng)造的和可靠的產(chǎn)品制造系統(tǒng)設(shè)計(jì)的首選。

在一個(gè)塑料的lsm6ds3柵格陣列（LGA）封裝是可用的。

Key Features

• Power consumption: 0.9 mA in combo normal mode and 1.25 mA in combo high-performance mode up to 1.6 kHz.

• “Always-on” experience with low power consumption for both accelerometer and gyroscope

• Smart FIFO up to 8 kbyte based on features set

• Compliant with Android K and L

• Hard, soft ironing for external magnetic sensor corrections

• ±2/±4/±8/±16 g full scale

• ±125/±245/±500/±1000/±2000 dps full scale

• Analog supply voltage: 1.71 V to 3.6 V

• Independent IOs supply (1.62 V)

• Compact footprint, 2.5 mm x 3 mm x 0.83 mm

• SPI/I²C serial interface with main processor data synchronization feature

• Embedded temperature sensor

• ECOPACK^?, RoHS and “Green” compliant

主要特點(diǎn)

功率消耗：0.9毫安的組合正常模式和1.25毫安的高達(dá)1.6千赫的高性能模式。

“總是”的經(jīng)驗(yàn)與低功耗的加速度計(jì)和陀螺儀

聰明的FIFO最多8字節(jié)的基于特征集

與安卓和升

外磁場(chǎng)傳感器的硬、軟熨燙

2、4、8、16、g

±125 / 245 / 500 /±±±1000 /±2000 DPS全面

模擬電源電壓：1.71伏至3.6伏

獨(dú)立的iOS電源（1.62 V）

緊湊的足跡，2.5毫米×3毫米×0.83毫米

SPI和I2C主處理器的數(shù)據(jù)同步功能的串行接口

嵌入式溫度傳感器

?Ecopack，ROHS和“綠色”標(biāo)準(zhǔn)